Nanoelectronics just got smaller - Graphene and Boron Nitride in atom-thick semiconductor fabrication

Cornell University researchers have found a way to stack Graphene and Boron Nitride layers and produce integrated circuits that are nanometers thick. The resulting electronic chips would be slimmer, smaller and flexible. The fabrication process sounded pretty similar to present day IC fabrication methods, involving etching and lithography to fuse the layers together.

There are still huge kinks in the technology to be corrected before this can become a reality, but the possibilities in applications are endless. This will be a huge breakthrough in flexible and transparent electronics - reminds me of Minority Report, although that's not the first movie to show the possible use of transparent electronics.

Read more here.